company news about Breaking through thermal and speed limits: How UV LEDs are reshaping next-generation precision electronics manufacturing

Pain Point: Traditional conformal coatings require a lengthy baking and air-drying process, often a major bottleneck on the production line. Prolonged high-temperature baking can degrade the performance of heat-sensitive components (such as capacitors and crystal oscillators) and even cause thermal stress warping of the PCB board.

UV LED Solution: Utilizes UV LED-cured conformal coating.

Efficiency Improvement: Curing time is reduced to T < 5 seconds, allowing immediate transition to the next process, significantly improving UPH (Units Per Hour).

Elimination of Thermal Damage: The radiation energy emitted by the UV LED light source is concentrated in the adhesive's absorption band, generating almost no heat, perfectly protecting precision components such as BGAs and QFNs.

Pain Point: Traditional adhesives require long curing times, making real-time calibration and feedback on the production line difficult, especially when handling flexible printed circuits (FPCs) or micro-sensors.

UV LED Solution: Used for temporary fixation and Glob Top encapsulation.

Precise Alignment: Before UV adhesive cures, operators or robotic arms can perform sub-micron level precision adjustments to components. Once the position is confirmed, 365nm or 395nm UV light instantly locks the component in place, ensuring zero positional drift.

Reinforced Encapsulation: When used for underfill, it provides excellent mechanical strength and vibration resistance, effectively mitigating stress caused by coefficient of thermal expansion (CTE) mismatch and improving product reliability.