A high-tech optical component manufacturer was struggling with yield rates during the exposure and hardening phase of wafer-level micro-lens fabrication.

• Irradiance Inconsistency: Traditional UV lamps failed to provide even light distribution across large substrate surfaces. Low light intensity at the margins led to incomplete polymerization and high product rejection rates.

• Thermal Expansion: Excessive infrared heat warped delicate sub-micron lens structures during the photolithography and curing process.

Instead of traditional mercury bulbs or dispensing methods, we deployed a High-Uniformity UV LED Flood Curing System specifically engineered for semiconductor-grade optical processing:

• Spin-Coated Resin Exposure: The system delivers full-surface flood exposure directly to the spin-coated photoresist/UV resin layer through a photomask.

• Advanced Optical Design: Custom-engineered lenses optimize light distribution, yielding an industry-leading irradiance uniformity of within ±3% across the entire curing area.

• True Cold Light Source: Operating at a precise 365nm narrow-band spectrum, the system eliminates infrared radiation, keeping the substrate at ambient room temperature to protect microstructures from thermal deformation.

• Flawless Product Consistency: Rejection rates caused by edge-curing deficiencies dropped to zero, thanks to the ultra-uniform UV light field.

• Sub-Micron Structural Integrity: Eliminating thermal stress ensured perfect dimensional stability for high-precision Fresnel lenses.

• Enhanced Production Efficiency: Instant UV LED on/off capabilities eliminated warm-up times, maximizing throughput for high-volume semiconductor lines.

[Contact Our Application Engineers for a Custom UV LED Solution-Shenzhen Super- curing Opto-Electronic CO., Ltd】