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Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation

Certification
China Shenzhen Super- curing Opto-Electronic CO., Ltd certification
China Shenzhen Super- curing Opto-Electronic CO., Ltd certification
Customer Reviews
We have cooperation for long long time ,it's a good experience .

—— Mike

Sincerely hope to we can cooperation next time soon.

—— Bok

I like your leduv flashlight very much it's hand-held and operation very easy.

—— Christophe

The UV lamp greatly improves the efficiency of our screen printing machine, it's great!

—— Alfie

The UV Curing Unit quality is excellent; I've used it for over a year without any problems.

—— Oliver

This lamp is perfect for curing silkscreen printing on our packaging. I love it.

—— Ethan

The UV LED curing lamps from this company are incredibly stable. We use them for our touch-screen bonding line, and the curing consistency is perfect.

—— David

They customized the perfect 365nm UV curing solution for our automated optical manufacturing line.

—— Elena

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Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation

Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation
Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation

Large Image :  Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation

Product Details:
Place of Origin: China
Brand Name: Super-curing
Certification: RoHS, REACH, ISO10993 certified
Model Number: 3526
Payment & Shipping Terms:
Minimum Order Quantity: 10 Pieces
Price: USD 3.99 / Piece/50g
Packaging Details: Plastic bottle, 50g/1kg per unit, export-grade carton
Delivery Time: 5-8 work days
Payment Terms: T/T,L/C
Supply Ability: 3000 Kilograms per Month

Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation

Description
Color: Transparent Black Viscosity (25°C): 6000±1000 MPa.s
Curing Condition: 600 MJ/cm2 (LED UV) Hardness: Shore D 40
Glass Transition Temperature (Tg): 10°C Dielectric Strength: 20 KV/mm
Shelf Life: 12 Months (8-28°C) Packaging: 50g / 1kg
Application: BGA Chip Stiffening, Component Bottom Fixation
Highlight:

UV curable adhesive for BGA chips

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Fast curing UV adhesive high adhesion

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UV cure adhesive component bottom fixation

Fast Curing UV Curable Adhesive

Fast Curing UV Curable Adhesive is a transparent black, LED-curable adhesive specially formulated for BGA chip stiffening and component bottom fixation. It offers high adhesion with excellent flexibility, low shrinkage and low dielectric constant, high thixotropy with good color visibility for easy dispensing, and LED 3-5 second fast curing, delivering reliable stiffening and protection for sensitive electronic components.

Key Features

  • Fast curing with LED 3-5 second cure for high-efficiency production
  • High adhesion with excellent flexibility for reliable BGA chip stiffening
  • Low shrinkage and low dielectric constant protect sensitive components
  • High thixotropy with good color visibility for easy and precise dispensing
  • Transparent black appearance for clean finished look and easy inspection
  • High dielectric strength of 20 kV/mm for insulation protection

Fast Curing UV Curable Adhesive High Adhesion BGA Chip Stiffening and Component Bottom Fixation

Applications

  • BGA chip stiffening (four-corner fixing) on PCB assemblies
  • Component bottom fixation and underfill
  • High-speed LED curing assembly lines
  • Fixing of sensitive electronic components requiring low stress
  • Protection of chips and components in consumer electronics

Technical Specifications

Color Transparent black
Viscosity (25°C) 6000±1000 mPa.s
Curing Condition 600 mJ/cm² (LED UV)
Hardness Shore D 40
Glass Transition Temperature (Tg) 10°C
Dielectric Strength 20 kV/mm
Shelf Life 12 months (8-28°C)
Packaging 50g / 1kg

FAQ

Q1: What is the 3526 adhesive mainly used for?
3526 is an LED-curable UV adhesive used for BGA chip stiffening and component bottom fixation, providing reliable fixing and protection for sensitive electronic components.

Q2: How fast does it cure?
3526 features LED 3-5 second fast curing at 600 mJ/cm², enabling high-efficiency production lines.

Q3: Is the cured adhesive flexible?
Yes. With Shore D 40 hardness, the cured adhesive offers excellent flexibility, helping to absorb stress and protect chips and delicate components.

Q4: Why are low shrinkage and low dielectric constant important?
Low shrinkage reduces internal stress during curing, while the low dielectric constant minimizes signal interference, making 3526 ideal for sensitive electronic applications.

Q5: What does the adhesive look like?
3526 is a transparent black adhesive with good color visibility, allowing easy inspection and precise dispensing during application.

Q6: What are the storage conditions?
Store at 8-28°C in the original sealed container. Shelf life is 12 months. Available in 50g and 1kg packaging.

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings
5 stars
100%
4 stars
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All Reviews

K
Kumar
India Mar 12.2026
This UV adhesive, specifically designed for curing lenses, works well on our company's PC lenses and FR4 boards, and we are very satisfied.
Contact Details
Shenzhen Super- curing Opto-Electronic CO., Ltd

Contact Person: Eric Hu

Tel: 0086-13510152819

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