PCBA Temporary Fixing UV/Heat Cure Glue Description
"Fast fixing, wave soldering safe." This PCBA temporary fixing UV/heat cure glue (3769B) is a solvent-free, fast-curing adhesive designed for temporary component fixing on PCBA automated assembly lines. With high thixotropy for excellent build-up and no slump, it delivers outstanding adhesion to PCB and metals, and its high elongation allows components to pass safely through wave soldering and reflow soldering.
PCBA Temporary Fixing UV/Heat Cure Glue Datasheet
| Model |
3769B PCBA temporary fixing glue |
Packaging specifications |
50g / 300g |
| Brand |
Super-curing |
Curing condition |
300 mJ/cm² (UV) |
| Application |
PCBA temporary fixing, SMT component fixing |
Viscosity (25°C) |
85,000 mPa·s |
| Adhesive material type |
PCB, metals |
Hardness |
68A |
| Color |
Pale yellow transparent |
Elongation at break |
400% |
| Shelf life |
12 months at 8-28°C |
Environmental protection level |
Superior |
Product Details Description
Product Applications
- PCBA temporary fixing of SMT components before wave soldering
- Component fixation on automated PCBA assembly lines
- Wave soldering and reflow soldering protection
- PCB and metal component adhesion
- Temporary bonding of components during reflow oven passage
- Electronics assembly line temporary fixing
- Fixing of connectors, SMD parts and heavy components before soldering
Precautions
- Surfaces must be clean, dry and free of oil, dust or flux residues before applying.
- High thixotropy keeps the adhesive in place; dispense precisely to avoid component movement.
- UV curing requires light to reach the adhesive; shadowed or blocked areas may not fully cure and may need heat cure.
- Apply in a well-ventilated area. Avoid contact with skin and eyes; wear protective gloves and safety goggles.
- In case of skin or eye contact, rinse immediately with plenty of clean water and seek medical advice if irritation persists.
- Store sealed at 8-28°C in a cool, dark and dry place away from direct sunlight, and keep out of reach of children.
- Fixing performance may vary with substrate, gap and UV intensity; please run a test before mass production.
FAQ
Q1: How does this PCBA temporary fixing glue cure?
It cures rapidly under UV light with a recommended cumulative UV energy of 300 mJ/cm². Curing speed depends on UV intensity, wavelength and layer thickness.
Q2: What substrates can it bond?
It offers excellent adhesion to PCB substrates and metals, making it suitable for fixing components on populated boards.
Q3: Is it safe for wave soldering and reflow soldering?
Yes. With a high elongation at break (400%) and high elasticity, it holds components securely and can pass safely through wave soldering and reflow soldering.
Q4: What is the advantage of the high thixotropy?
The high thixotropy (viscosity 85,000 mPa·s) gives excellent build-up with no slump, keeping the adhesive exactly where dispensed for stable component fixing.
Q5: What is the packaging and minimum order quantity?
Standard packaging is 50g / 300g bottles, and the minimum order quantity is 10 pieces. Custom packaging is available on request.
Q6: How should it be stored and what is its shelf life?
Store sealed at 8-28°C in a cool, dark and dry place away from direct sunlight. Unopened shelf life is approximately 12 months.
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