Heat Resistant Temporary Peelable Masking Glue Description
"Protect through the heat, peel off clean." This heat resistant temporary peelable masking glue (3769D) is a blue-red, silicone-free UV curing masking adhesive developed for temporary protection of PCBA electronic components during wave soldering. It reliably withstands wave soldering and reflow soldering thermal profiles, features high thixotropy for excellent stacking without slump, cures fast, and peels off easily. With a low-shrinkage formulation, 3769D keeps sensitive components safe from solder splash, flux, contamination and mechanical stress during assembly and soldering.
Heat Resistant Temporary Peelable Masking Glue Datasheet
| Model |
3769D UV peelable masking adhesive |
Packaging specifications |
50g / 300g |
| Brand |
Super-curing |
Cure condition |
400 mJ/cm² (UV) |
| Application |
Temporary protection of PCBA electronic components; withstands wave and reflow soldering |
Viscosity (25°C) |
65000 mPa·s |
| Substrates |
Electronic components, PCB |
Hardness |
60 Shore A |
| Color |
Blue red |
Elongation at break |
160% |
| Storage condition |
12 months at 8-28°C |
Silicone content |
Silicone free |
Product Details Description
Product Applications
- Wave soldering protection for PCBA components
- Reflow soldering protection for sensitive electronic components
- Temporary masking of PCB areas that must stay solder-free
- Protection from solder splash, flux and contamination during assembly
- Stacking and dam dispensing with high thixotropy, no slump
- Silicone-sensitive assemblies requiring subsequent coating or bonding
- Component protection during handling, testing and transport
- Clean peel-off after soldering with no residue
Precautions
- Surfaces must be clean, dry and free of oil, dust or flux residues before dispensing.
- Apply a uniform mask thickness; avoid excess build-up around pads and connectors.
- UV curing requires light to reach the mask; shadowed areas may need additional passes.
- Confirm mask stability against the actual wave and reflow thermal profile before mass production.
- Apply in a well-ventilated area. Avoid contact with skin and eyes; wear protective gloves and safety goggles.
- In case of skin or eye contact, rinse immediately with plenty of clean water and seek medical advice if irritation persists.
- Store sealed at 8-28°C in a cool, dark and dry place away from direct sunlight, and keep out of reach of children.
FAQ
Q1: What is this heat resistant masking glue mainly used for?
It is a peelable masking glue for temporary protection of PCBA electronic components during wave soldering and reflow soldering. Once protection is no longer required, it peels off easily without residue.
Q2: Can it withstand wave soldering and reflow soldering?
Yes. 3769D is formulated to remain intact and protective through both wave soldering and reflow soldering thermal profiles, then peel off cleanly afterwards.
Q3: How is it applied and cured?
It is applied by dispensing, with high thixotropy for excellent stacking and no slump, and cures rapidly under UV energy of about 400 mJ/cm².
Q4: Does it leave residue after peeling?
No. The cured mask peels off easily and cleanly, leaving no residue on the protected PCBA and electronic components.
Q5: Why is a silicone-free formulation important?
Being silicone-free prevents silicone contamination that can disturb subsequent conformal coating, bonding or soldering on the assembly, and low shrinkage minimizes stress on components.
Q6: How should it be stored and what is its shelf life?
Store sealed at 8-28°C in a cool, dark and dry place away from direct sunlight. Unopened shelf life is approximately 12 months. Available in 50g and 300g packages.
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