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Product Details:
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| Viscosity (25°C): | 2000±200 MPa.s | Color: | Transparent |
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| Dielectric Constant: | Low | Tensile Strength: | 8 MPa |
| Thixotropy: | High, Good Visibility | Elongation At Break: | 200% |
| Packaging: | 1kg | Application: | Earphone Solder Joint Protection, Component Fixing |
| Curing Condition: | 600 MJ/cm² (UV / LED) | Hardness: | Shore A 50 |
| Shelf Life: | 12 Months (8-28°C) | ||
| Highlight: | Earphone UV fixation glue fast curing,TWS earbuds solder joint adhesive,UV cure adhesives for electronics |
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Earphone UV Fixation Glue Description
"Fix fast, protect joints." This earphone UV fixation glue (3572) is a transparent, fast-curing UV adhesive specially formulated for solder joint protection of TWS earbuds and precision component fixing. It offers high adhesion and high toughness, low shrinkage and low dielectric constant, and high thixotropy with good visibility for convenient dispensing. It cures rapidly under LED or UV light in just 3-5 seconds, making it an ideal choice for high-throughput earphone assembly lines.
Earphone UV Fixation Glue Datasheet
| Model | 3572 UV curing fixation glue | Packaging specifications | 1kg |
| Brand | Super-curing | Cure condition | 600 mJ/cm² (UV / LED) |
| Application | Earphone solder joint protection and component fixing | Viscosity (25°C) | 2000±200 mPa·s |
| Substrates | Plastic and metal parts | Hardness | Shore A 50 |
| Color | Transparent | Tensile strength | 8 MPa |
| Storage condition | 12 months (8-28°C) | Elongation at break | 200% |
| Thixotropy | High, good visibility | Dielectric constant | Low |
Product Details Description
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Product Applications
Precautions
FAQ
Q1: What is this earphone UV fixation glue mainly used for?
It is a UV curing fixation glue used for solder joint protection of TWS earbuds and earphones, and for fixing small electronic components in precision assemblies.
Q2: How fast does it cure?
It cures rapidly under LED or UV light in about 3-5 seconds, enabling high throughput on automated earphone production lines.
Q3: What adhesion and toughness does it provide?
It offers high adhesion and high toughness, providing reliable bonding and protection for solder joints and small components.
Q4: Does it have low shrinkage and low dielectric constant?
Yes. It features low shrinkage and a low dielectric constant, making it suitable for precision electronic applications sensitive to stress and electrical performance.
Q5: Is it easy to dispense?
Yes. It has high thixotropy with good visibility, so it dispenses cleanly and stays in place without sagging.
Q6: What are the storage conditions and packaging?
Store sealed at 8-28°C in the original container. Shelf life is 12 months. Available in 1kg packaging with export-grade carton.
Contact Person: Eric Hu
Tel: 0086-13510152819