3169K UV Curing Adhesive for PCB Solder Joint Protection and Electronic Component Sealing
Product Overview
3169K is a one-component UV/visible-light-curable adhesive developed for electronic manufacturing applications. It is designed for electronic component sealing, PCB solder joint protection, wire harness terminal fixing, and lithium battery protection board fixation.
The adhesive is a colorless, transparent liquid before curing. After curing under suitable light conditions, it forms a tough bonding layer with good impact resistance, vibration resistance, and aging resistance.
Combined with a compatible industrial UV LED curing system, 3169K provides a practical solution for localized bonding, sealing, and protection in electronic assembly processes.
Key Features and Benefits
1. Designed for PCB Solder Joint Protection
3169K is suitable for localized protection of PCB solder joints and electronic connections. It can help secure and protect selected connection areas when the adhesive is properly applied and cured.
2. Electronic Component Sealing
The adhesive is designed for sealing and protecting electronic components made from compatible materials. Its transparent appearance allows the finished application area to remain visually inspectable.
3. Strong and Tough Bonding Layer
After curing, the adhesive forms a tough layer. The technical data sheet reports a Shore D hardness of 80 and a tensile strength of 13 MPa under the specified laboratory test conditions.
4. Good Impact and Vibration Resistance
The formulation is designed to provide resistance to impact and vibration, making it suitable for evaluating in electronic assemblies exposed to mechanical movement or vibration.
5. Electrical Properties
The technical data sheet reports a dielectric strength of 20 kV/mm, a dielectric constant of 2.4 at 1 MHz, and a dielectric loss of 0.03 at 1 MHz.
Actual electrical performance depends on the application design, adhesive thickness, curing quality, substrate, and operating environment. Application testing is recommended.
6. UV/Visible-Light Curing
3169K can be cured using a suitable UV or visible-light source that matches the adhesive's curing requirements and reaches the adhesive layer.
Compatible light sources and exposure parameters should be selected according to the technical data sheet and verified under actual production conditions.
Typical Applications
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PCB solder joint protection
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Electronic component sealing
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Wire harness terminal fixing
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Lithium battery protection board fixation
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Localized bonding and protection of electronic assemblies
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Selected plastic, glass, and metal bonding applications
Suitable Materials
The technical data sheet lists the following materials:
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Printed circuit boards (PCB)
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Glass
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Aluminum and stainless steel (SU304)
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Polycarbonate (PC)
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Polyvinyl chloride (PVC)
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Acrylonitrile butadiene styrene (ABS)
Compatibility should be verified for the specific substrate grade, surface finish, and application.
Product Technical Specifications
Product model: 3169K
Product type: One-component UV/visible-light-curable adhesive
Base material: Polyurethane acrylate
Appearance: Colorless, transparent liquid
Viscosity at 25°C: 12,000 ± 1,500 mPa·s
Specific gravity at 25°C: 1.08
Hardness after curing: Shore D 80
Tensile strength: 13 MPa
Shear strength (PC/PC): Greater than 4 MPa
Shear strength (PC/aluminum): Greater than 7 MPa
Water absorption: 2.6% (100°C, 2 hours)
Dielectric constant (1 MHz): 2.4
Dielectric loss (1 MHz): 0.03
Dielectric strength: 20 kV/mm
Packaging: 50 g per tube; 100 tubes per carton
Storage temperature: 8–28°C, protected from light in a cool, dry place
Shelf life: 12 months under the specified storage conditions
Reference: 3169K Technical Data Sheet, revision date November 3, 2021.
Recommended Curing Conditions
The technical data sheet provides the following reference conditions:
395 nm UV LED area source
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Light-source power: 200 W
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Reference curing time: 5 seconds
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Reported accumulated energy: 6,000 mJ/cm² for a 2 mm adhesive layer
365 nm UV LED area source
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Light-source power: 200 W
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Reference curing time: 5 seconds
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Reported accumulated energy: 3,500 mJ/cm² for a 1 mm adhesive layer
365 nm mercury lamp
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Light-source power: 4,000 W
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Reference curing time: 20 seconds
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Reported accumulated energy: 1,200 mJ/cm² for a 2 mm adhesive layer
These are reference conditions from the product's technical data sheet, not guaranteed settings for every machine or application. Curing performance varies with irradiance, working distance, light spectrum, exposure time, adhesive thickness, and substrate transmittance.
The appropriate UV LED curing system and process parameters should be verified through testing before production.
Application Procedure
Step 1: Surface Preparation
Clean the PCB and bonding area to remove dust, oil, and other contaminants. Ensure that the substrate is compatible with the adhesive.
Step 2: Precision Dispensing
Apply the required amount of 3169K to the designated solder joint, electronic connection, or component sealing area. Avoid contaminating electrical contacts or other areas that must remain clean.
Step 3: Component Positioning
Position the component or wire terminal as required. Ensure that the adhesive covers the intended bonding or sealing interface.
Step 4: UV/Visible-Light Curing
Expose the adhesive to a compatible light source. Confirm that the light reaches the adhesive layer and that the selected wavelength, irradiance, exposure time, and working distance meet the required curing conditions.
Step 5: Quality Inspection
Inspect the finished assembly for adhesive coverage, component positioning, and curing quality. Conduct appropriate electrical, mechanical, and environmental tests where required.
Compatible Industrial UV LED Curing Equipment
We specialize in industrial UV LED curing equipment and can help evaluate a suitable curing solution for electronic assembly applications.
Available equipment configurations include:
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Water-cooled UV LED curing systems
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Air-cooled UV LED curing systems
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Handheld UV LED curing lamps
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Customized UV LED curing heads for production-line integration
The recommended equipment depends on the required wavelength, curing area, working distance, adhesive thickness, and production cycle time.
For PCB solder joint protection and electronic component sealing, the curing source should be selected according to the actual adhesive specification rather than wavelength alone.
Packaging and Storage
Standard packaging listed in the technical data sheet: 50 g per tube, 100 tubes per carton.
Store at 8–28°C in a cool, dry place protected from light. The stated shelf life is 12 months under the specified storage conditions.
The adhesive is light-sensitive. Control exposure to daylight, UV light, and other light sources during storage and handling. Do not return unused adhesive to the original container.
Safety Information
For industrial use only. Avoid contact with eyes and skin. If contact occurs, follow the safety data sheet instructions and rinse the affected area appropriately. Keep the product out of reach of children.
Please consult the applicable Safety Data Sheet (SDS) before handling and use.
Request a Quote
Looking for a UV adhesive for PCB solder joint protection or electronic component sealing?
Contact us with your PCB material, bonding area, required curing time, and production requirements. We can help evaluate the application and recommend a compatible industrial UV LED curing system.
Application performance should be confirmed through testing under the customer's actual production conditions.
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