3572 Flexible UV Adhesive Headphone Solder Joint Protection 200% Elongation 30ml Fast LED Cure for Compact Electronics

3572 Flexible UV Adhesive for Headphone Solder Joint Protection

The 3572 is a flexible, single component UV curable adhesive developed for headphone manufacturing and compact electronic assemblies. It is used to encapsulate solder joints, fix delicate components and reinforce fine wires where a rigid bond would create stress and cracking.

Key Features

• High adhesion with flexibility – bonds strongly to solder, copper, FR4, plastic and anodized aluminium while remaining elastic, so repeated bending of earphone cables and hinges does not crack the joint.
• 200% elongation at break – the cured film stretches to twice its original length, absorbing drop impact, vibration and cable flexing that commonly cause headphone solder failures.
• Low shrinkage – minimal volumetric shrinkage during cure avoids stress on tiny solder pads and voice coil leads, keeping acoustic performance stable.
• Fast UV LED curing – cures in seconds under 365 nm or 395 nm UV LED lamps, matching high speed headphone assembly lines and reducing work in progress.
• Flexible solution for compact electronics – low viscosity grades flow into narrow gaps, while thixotropic grades stay in place for vertical surfaces and wire tacking.

Recommended Applications

• Protection of headphone and earphone solder joints
• Fixing of speaker drivers, voice coils and small PCB components
• Strain relief of fine wires and flexible circuits
• Encapsulation of sensors and connectors in wearable devices

Typical Technical Data

Processing Notes

Dispense the adhesive onto the cleaned solder joint or component, then cure with a UV LED spot or line system. Shadowed areas under wires can be cured with a short secondary exposure. Keep the container closed and store away from light and heat.

Different viscosities, cure speeds and packaging volumes are available for OEM projects. Send us your application and we will recommend the matching grade.