1200W Water Cooled LED UV Curing System CG-CT5-20050-1200W 200x50mm for Optical Module Semiconductor Bonding

CG-CT5-20050-1200W Water Cooling LED UV Curing Machine for Semiconductor and Optical Module Bonding

The CG-CT5 series is a linear water-cooled UV LED curing head built for semiconductor assembly and optical communication production lines. A 200 x 50 mm emitting window, 1200W optical output and 18W/cm² peak irradiance deliver deep, uniform through-cure of optical grade UV adhesives used in die attach, lens bonding and fiber array fixing, with no mercury, no ozone and no VOC discharge.

Technical Specifications

Applications In Semiconductor And Optical Communication Production

• Die attach and chip bonding UV adhesive curing
• Wafer level lens, VCSEL and photodiode bonding
• Optical module, TOSA / ROSA and fiber array adhesive curing
• Lens barrel alignment and fixing in camera, LiDAR and sensor modules
• Underfill and edge seal curing for CIS and image sensor packages
• Photonic device and waveguide package curing

Why Assembly Lines Choose This Curing Head

• Deep through cure: 18W/cm² peak irradiance cures 1-3 mm optical grade UV adhesive in seconds, so die attach and lens bonding reach handling strength without a second pass.
• Cold light output: substrate temperature rise stays low, protecting coated wafers, lens coatings and temperature sensitive optics from warpage or shift.
• Instant on/off: no warm-up and no shutter delay, ready for high-speed indexing bonders and short takt cycles.
• Repeatable output: constant-current power supply holds UV intensity stable across an 8 hour shift, keeping the cure profile the same from first part to last.
• Full strip coverage: the 200 x 50 mm window cures a wafer strip or a row of modules in one pass, and the window length and width can be customized.
• Cleanroom friendly: mercury free and ozone free, with no lamp disposal cost and no VOC discharge.
• 20,000 hour lamp life with 2 year warranty on the complete system.

Working Notes

Connect the lamp head to a matched water chiller. Recommended coolant flow is 6-10 L/min with inlet water temperature below 25°C. Keep the quartz lens clean and hold the emitting window 30-50 mm from the substrate to obtain the rated UV intensity. For deep adhesive cure choose 365 nm; use 385 / 395 nm where the adhesive is formulated for near-visible UV.

FAQ

Q: Which wavelength suits optical adhesive curing?
A: 365nm is preferred for die attach, lens bonding and other deep cure adhesives; 385nm and 395nm are used where the adhesive is formulated for near-visible UV.

Q: Can the emitting window be tailored to my bonder?
A: Yes. The CT5 platform is available in other lengths and widths on request.

Q: Is the UV output repeatable for production?
A: Yes. The constant-current supply with 0-100% stepless dimming keeps the cure profile repeatable run after run, and intensity can be set per product recipe.

Q: What is the lead time?
A: 10-15 working days for standard configurations.