UV Temporary Fixing Adhesive High Thixotropy PCB Component Bonding for Reflow Wave Soldering 3769B 85000mPa.s

Product Overview

UV Temporary Fixing Adhesive

3769B is a light-yellow transparent, solvent-free UV-curable adhesive specially developed for temporary component fixing on PCBA automatic assembly lines. It features high thixotropy with excellent stacking performance, strong adhesion to PCB and metal, and high elongation to withstand the thermal stress of wave soldering and reflow soldering. Curing rapidly under UV energy of 300 mJ/cm², 3769B keeps components firmly in position through the whole assembly and soldering process.

Key Features

• Fast curing, solvent-free - quick UV cure at 300 mJ/cm² boosts assembly line efficiency and meets environmental requirements
• High thixotropy, excellent stacking - dispensed dots and beads hold their shape without slumping, ideal for stacking height control
• Excellent adhesion to PCB and metal - reliable temporary fixing on PCB substrates, pads, leads and metal parts
• High elongation - 400% elongation at break, able to pass wave soldering and reflow soldering without cracking or losing hold
• PCBA automation friendly - designed for component fixing on PCBA automatic assembly lines
• Clean light-yellow transparent appearance - easy visual inspection after dispensing

Technical Specifications

Product Applications

3769B is designed for temporary fixing and positioning of components on PCBA automatic assembly lines. Typical applications include:

• PCBA component fixing - temporarily holds SMT and THT components, connectors, coils and wires in position during automatic assembly before soldering
• Wave soldering support - high elongation allows the fixing bond to pass through wave soldering without cracking or displacement
• Reflow soldering support - maintains component position through reflow thermal profiles
• PCB and metal assembly - strong adhesion to PCB substrates, solder pads, metal leads and frames
• Dispensing stacking - high thixotropy formulation keeps dispensed dots and beads stacked without slump, suitable for automated dispensing systems
• Temporary positioning - reliable fixing during handling, transfer and soldering processes on high-speed assembly lines

Frequently Asked Questions

1. What is 3769B UV adhesive mainly used for?
   It is used for temporary fixing and positioning of electronic components on PCBA automatic assembly lines, holding components firmly in place before and during wave or reflow soldering to prevent displacement.
2. Which substrates does 3769B bond well to?
   It offers excellent adhesion to PCB substrates (such as FR-4), solder pads, metal leads, frames and other metal parts commonly found in PCBA manufacturing.
3. What curing energy does 3769B require?
   It cures rapidly under UV light with an energy dose of about 300 mJ/cm², which supports high-speed automatic assembly line throughput.
4. Can 3769B withstand wave and reflow soldering?
   Yes. With 400% elongation at break, the cured adhesive absorbs thermal expansion and mechanical stress during wave soldering and reflow soldering without cracking or losing its holding force.
5. Is 3769B solvent-free and environmentally friendly?
   Yes. 3769B is a 100% solvent-free formulation, meeting environmental and workplace safety requirements while avoiding solvent-related bubbles or outgassing during soldering.
6. How should 3769B be stored and what is its shelf life?
   Keep the container sealed and store at 8-28°C in a cool, dry place away from direct sunlight and UV sources. Under proper storage conditions, the shelf life is 12 months. Available in 50g and 300g packages.

Packaging & Storage

Available in 50g and 300g packages. Store in a sealed container at 8-28°C, away from direct sunlight and UV exposure. Shelf life: 12 months.