UV Peelable Masking Adhesive Silicone Free Wave Reflow Soldering Resistant for Electronics Protection 3769D

Product Overview

UV Peelable Masking Adhesive

3769D is a blue-red, UV-curable peelable masking adhesive developed for temporary protection of electronic components. It reliably withstands wave soldering and reflow soldering, features high thixotropy for excellent stacking performance, cures fast, and peels off easily. With a silicone-free, low-shrinkage formulation, 3769D keeps sensitive electronics safe from contamination and mechanical stress during assembly and soldering processes.

Key Features

• Wave and reflow soldering resistant - the cured mask stays intact and protective through wave soldering and reflow soldering thermal profiles
• High thixotropy, excellent stacking - dispensed mask holds its shape without slump, ideal for stacking and dam applications
• Fast curing, easy to peel - quick UV cure at 400 mJ/cm² and clean, easy peel-off after protection is no longer needed
• Low shrinkage - minimizes internal stress and keeps the mask dimensionally stable on components
• Silicone-free - avoids silicone contamination that can affect subsequent coating, bonding and soldering processes
• Temporary electronics protection - shields electronic components during assembly, handling and soldering

Technical Specifications

Product Applications

3769D is designed for temporary masking and protection of electronic components during assembly and soldering. Typical applications include:

• Wave soldering protection - masks sensitive components and areas that must stay protected while the assembly passes through wave soldering
• Reflow soldering protection - maintains a stable protective mask through reflow soldering thermal profiles
• Electronic component temporary protection - shields components from solder splash, flux, contamination and mechanical contact during assembly
• Stacking and dam dispensing - high thixotropy allows precise stacked or dam-shaped application without slump
• Silicone-sensitive applications - silicone-free formulation is safe for assemblies that require subsequent conformal coating, bonding or soldering
• Clean removal - after soldering and assembly, the mask peels off easily, leaving components clean and residue-free

Frequently Asked Questions

1. What is 3769D mainly used for?
   It is a peelable masking adhesive for temporary protection of electronic components during assembly and soldering processes. Once protection is no longer required, it is peeled off easily without residue.
2. Can 3769D withstand wave and reflow soldering?
   Yes. 3769D is formulated to remain intact and protective through both wave soldering and reflow soldering, then peel off cleanly afterwards.
3. How is 3769D applied and cured?
   It is applied by dispensing, with high thixotropy for excellent stacking and no slump, and cures rapidly under UV energy of about 400 mJ/cm².
4. Does 3769D leave residue after peeling?
   No. The cured mask peels off easily and cleanly, leaving no residue on the protected electronic components.
5. Why is 3769D silicone-free and low-shrinkage?
   Being silicone-free prevents silicone contamination that can disturb subsequent coating, bonding or soldering on the assembly; low shrinkage minimizes stress on components and keeps the mask dimensionally stable.
6. How should 3769D be stored and what is its shelf life?
   Keep the container sealed and store at 8-28°C in a cool, dry place away from direct sunlight and UV sources. Under proper storage conditions, the shelf life is 12 months. Available in 50g and 300g packages.

Packaging & Storage

Available in 50g and 300g packages. Store in a sealed container at 8-28°C, away from direct sunlight and UV exposure. Shelf life: 12 months.