UV Curing Component Fixing Adhesive Thixotropic High Viscosity Low Shrinkage PCB Inductor Capacitor Bonding

UV Curing Component Fixing Adhesive

352 UV Curing Component Fixing Adhesive is a thixotropic high-viscosity adhesive specially formulated for fixing electronic components, PCB boards, inductors and capacitors. It features a tough formulation with low curing shrinkage, excellent surface drying and deep curing performance, and outstanding resistance to high temperature high humidity and high/low temperature shock. It also provides moisture-proof insulation and is suitable for shallow potting applications.

Key Features

• Thixotropic high viscosity with multiple viscosity options available
• Tough formulation with low curing shrinkage for stable fixing
• Excellent surface drying and deep curing performance
• Outstanding resistance to high temperature high humidity and high/low temperature shock
• High dielectric strength of 22 kV/mm for insulation protection
• Light yellow transparent appearance suitable for visible applications

Applications

• Fixing of electronic components on PCB boards
• Bonding and fixing of inductors and capacitors
• Moisture-proof insulation of electronic assemblies
• Shallow potting and encapsulation applications
• General electronic assembly fixing requiring high reliability

Technical Specifications

FAQ

Q1: What is the 352 adhesive mainly used for?
352 is a UV curing component fixing adhesive used for fixing electronic components, PCB boards, inductors and capacitors, as well as moisture-proof insulation and shallow potting.

Q2: What viscosity options are available?
It features thixotropic high viscosity with multiple viscosity options available, allowing selection according to different application and dispensing requirements.

Q3: How is the curing shrinkage?
The tough formulation delivers low curing shrinkage, ensuring stable and reliable component fixing after curing.

Q4: Does it cure well on the surface and in depth?
Yes. 352 provides excellent surface drying and deep curing performance for reliable curing across different adhesive thicknesses.

Q5: How does it perform in harsh environments?
It offers outstanding resistance to high temperature high humidity and high/low temperature shock, maintaining reliable performance over time.

Q6: What are the storage conditions?
Store at 8-28°C in the original sealed container. Shelf life is 12 months. Available in 250ml and 1kg packaging.