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Product Details:
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| Refractive Index: | 1.51-1.625 | Curing Condition: | 600 MJ/cm² (UV) |
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| Temperature Resistance: | -50°C To 150°C | Substrates: | PCB, Plastic, Glass, Metal |
| Appearance: | Clear Or Colored Liquid | Cure Condition: | 1200 MJ/cm2 |
| Dielectric Constant: | Low | Thixotropy: | High, Good Visibility |
| Storageconditions: | Store In A Cool, Dark Place | Cure Options: | LED UV, UV Moisture, UV Thermal |
| Silicone Content: | Silicone Free | Applicationmethod: | Dispensing, Brushing, Or Spraying |
| Elongation At Break: | 150% | Toxicity: | Low VOC, Generally Safe When Cured |
| Weight: | 1Kg | ||
| Highlight: | 3166 UV adhesive solder joint protection,UV cure adhesive solder joint,3166 UV cure adhesive |
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Product Features:
Medium-high viscosity
Excellent surface and deep curing performance
Thixotropic properties with excellent dispensing characteristics
Excellent adhesion to a wide range of materials, including plastics, metals, and glass
Suitable for electronic solder joint protection and reinforcement of various wires and cables
Contact Person: Eric Hu
Tel: 0086-13510152819