3769B PCB Assembly Temporary Fixing UV Adhesive 85000 mPa.s Thixotropic Shore A 68 400% Elongation

3769B Temporary Fixing UV Adhesive for PCB Assembly

3769B is a high viscosity UV curing adhesive developed for temporary component fixing in electronics manufacturing. It features excellent thixotropy and strong adhesion to PCB substrates and metal surfaces, holds its dispensed shape without slumping, and provides reliable component positioning during assembly.

Its high elongation and flexibility allow components to withstand subsequent wave soldering and reflow soldering processes, then be removed cleanly after the temporary bonding step.

Key Features

• Fast UV curing for efficient assembly
• High thixotropy and excellent shape retention after dispensing
• Strong adhesion to PCB and metal surfaces
• High elongation and flexibility (400% at break)
• Suitable for automated dispensing systems
• Compatible with wave soldering and reflow soldering processes
• Solvent free formulation

Applications

• Temporary fixing of PCB components
• PCBA assembly
• Electronic component positioning
• Automated electronics production lines
• Temporary bonding during soldering

Technical Specifications

Recommended Curing System

Designed for UV LED curing applications. The suitable UV wavelength, irradiance and exposure time should be determined by actual process testing on your production line, taking into account substrate, bond geometry and line speed.

Why Choose This Adhesive

85,000 mPa·s high viscosity combined with high thixotropy keeps the adhesive bead exactly where it is dispensed on the board, while Shore A 68 hardness and 400% elongation absorb thermal and mechanical stress during soldering. The solvent free formula supports clean, low-void assemblies for automated PCBA lines.

Contact us for datasheet, samples and OEM/ODM packaging options.